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wafer sawing

См. также в других словарях:

  • Wafer-scale integration — Wafer scale integration, WSI for short, is a yet unused system of building very large integrated circuit networks that use an entire silicon wafer to produce a single super chip . Through a combination of large size and reduced packaging, WSI… …   Wikipedia

  • Wafer dicing — is the process by which individual silicon chips or integrated circuits on a silicon wafer are separated following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a …   Wikipedia

  • Wafer (electronics) — Polished 12 and 6 silicon wafers. The flat cut into the right wafer indicates its doping and crystallographic orientation (see below) …   Wikipedia

  • Wafer —   A thin sheet of semiconductor (photovoltaic material) made by cutting it from a single crystal or ingot.   U.S. Dept. of Energy, Energy Information Administration s Energy Glossary   ***   A thin sheet of semiconductor material made by… …   Energy terms

  • Solar cell — A solar cell made from a monocrystalline silicon wafer …   Wikipedia

  • String ribbon — solar cells is proprietary technology developed by Evergreen Solar. Technology descriptionString Ribbon describes a method of producing high grade silicon wafers suitable for the photovoltaics industry. The name describes the manufacturing… …   Wikipedia

  • Etching (microfabrication) — Etching tanks used to perform Piranha, Hydrofluoric acid or RCA clean on 4 inch wafer batches at LAAS technological facility in Toulouse, France Etching is used in microfabrication to chemically remove layers from the surface of a wafer during… …   Wikipedia

  • materials science — the study of the characteristics and uses of various materials, as glass, plastics, and metals. [1960 65] * * * Study of the properties of solid materials and how those properties are determined by the material s composition and structure, both… …   Universalium

  • Microelectromechanical systems — (MEMS) (also written as micro electro mechanical, MicroElectroMechanical or microelectronic and microelectromechanical systems) is the technology of very small mechanical devices driven by electricity; it merges at the nano scale into… …   Wikipedia

  • Diamond tool — A close up of the segment of a diamond saw blade A diamond tool is a cutting tool with diamond grains fixed on the functional parts of the tool via a bonding material or another method.[1] As diamond is a superhard material, diamond tools have… …   Wikipedia

  • Laser cutting — process on a sheet of steel. CAD (top) and stainless steel laser cut part (bottom) Laser cutting is a technology that uses a laser to cut materials, an …   Wikipedia

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