-
1 wafer sawing
underwater sawing — разрезание под водой; подводная резка
-
2 wafer sawing
Механика: отрезка тонких дисков -
3 wafer sawing
-
4 wafer sawing
English-Russian dictionary of mechanical engineering and automation > wafer sawing
-
5 sawing
разрезание; отрезание; резка, отрезка || отрезной- band sawingsawing to length — резка ( материала) на заготовки заданной длины
- circular sawing
- cold sawing
- electric discharge sawing
- electrical discharge sawing
- friction sawing
- miter sawing
- wafer sawingEnglish-Russian dictionary of mechanical engineering and automation > sawing
-
6 abrasive sawing
English-Russian big polytechnic dictionary > abrasive sawing
-
7 cold sawing
-
8 miter sawing
См. также в других словарях:
Wafer-scale integration — Wafer scale integration, WSI for short, is a yet unused system of building very large integrated circuit networks that use an entire silicon wafer to produce a single super chip . Through a combination of large size and reduced packaging, WSI… … Wikipedia
Wafer dicing — is the process by which individual silicon chips or integrated circuits on a silicon wafer are separated following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a … Wikipedia
Wafer (electronics) — Polished 12 and 6 silicon wafers. The flat cut into the right wafer indicates its doping and crystallographic orientation (see below) … Wikipedia
Wafer — A thin sheet of semiconductor (photovoltaic material) made by cutting it from a single crystal or ingot. U.S. Dept. of Energy, Energy Information Administration s Energy Glossary *** A thin sheet of semiconductor material made by… … Energy terms
Solar cell — A solar cell made from a monocrystalline silicon wafer … Wikipedia
String ribbon — solar cells is proprietary technology developed by Evergreen Solar. Technology descriptionString Ribbon describes a method of producing high grade silicon wafers suitable for the photovoltaics industry. The name describes the manufacturing… … Wikipedia
Etching (microfabrication) — Etching tanks used to perform Piranha, Hydrofluoric acid or RCA clean on 4 inch wafer batches at LAAS technological facility in Toulouse, France Etching is used in microfabrication to chemically remove layers from the surface of a wafer during… … Wikipedia
materials science — the study of the characteristics and uses of various materials, as glass, plastics, and metals. [1960 65] * * * Study of the properties of solid materials and how those properties are determined by the material s composition and structure, both… … Universalium
Microelectromechanical systems — (MEMS) (also written as micro electro mechanical, MicroElectroMechanical or microelectronic and microelectromechanical systems) is the technology of very small mechanical devices driven by electricity; it merges at the nano scale into… … Wikipedia
Diamond tool — A close up of the segment of a diamond saw blade A diamond tool is a cutting tool with diamond grains fixed on the functional parts of the tool via a bonding material or another method.[1] As diamond is a superhard material, diamond tools have… … Wikipedia
Laser cutting — process on a sheet of steel. CAD (top) and stainless steel laser cut part (bottom) Laser cutting is a technology that uses a laser to cut materials, an … Wikipedia